Antenna Feeder Package Structure and Packaging Method

ABSTRACT

The present disclosure provides an antenna package structure and packaging method. The package structure includes: a metal joint pin fabricated by using a wire bonding process; and a packaging layer, covering the metal joint pin. An antenna circuit chip and an antenna metal layer are electrically connected to two ends of the antenna feeder package structure.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is a divisional application of the U.S. patentapplication Ser. No. 16/354,477, which is the Continuation Applicationof the U.S. patent application Ser. No. 16/286,310. This applicationclaims the benefits of priority to Chinese Patent Application No.CN2018102175884X, entitled “Packaging Structure and Packaging Method forAntenna”, filed with CNIPA on Mar. 16, 2018, Chinese Patent ApplicationNo. CN2018203598256, entitled “Packaging Structure for Antenna”, filedwith CNIPA on Mar. 16, 2018, Chinese Patent ApplicationNo.CN2018113259510, entitled “Antenna Feeder Package Structure andAntenna Feeder Packaging Method”, filed with CNIPA on Nov. 8, 2018, andU.S. patent application Ser. No. 16/286,310, entitled “PackagingStructure and Packaging Method for Antenna”, filed with USPTO on Feb.26, 2019, the contents of which are incorporated herein by reference inits entirety.

TECHNICAL FIELD

The present disclosure relates to the field of semiconductor packagingtechnology, and in particular, to an antenna feeder package structureand a method of making thereof.

BACKGROUND

With the advancement of science and technologies, various high-techelectronic products, including various electronic apparatuses such asnotebook computers, mobile phones, and tablet computers (PAD), have beendeveloped to meet people's needs.

In addition to significant increases in functions and applicationsenabled by these high-tech products, a wireless communication functionneeds to meet mobile device requirements, so people may use thesehigh-tech electronic products anywhere and anytime using the wirelesscommunication functions. Flexibility and convenience of these high-techelectronic products have been significantly improved. Today people nolonger need to call from limited areas, and their lives are benefitedbecause of application of these electronic products.

In general, wireless communication involves antennas. Existing antennastructures on IC circuits include dipole antenna, monopole antenna,patch antenna, planar inverted-F antenna, meander line antenna,inverted-L antenna, loop antenna, spiral antenna, spring antenna, andthe like. A known approach manufactures an antenna directly on thesurface of a circuit board. In this approach, the antenna may occupy anadditional area of the circuit board, which is relatively undesirable.For various electronic apparatus, a large circuit board results in alarge electronic apparatus. However, a main purpose of designing anddeveloping these electronic apparatus is to enable a user toconveniently carry the electronic apparatuses. Therefore, a problem tobe solved is to reduce the antenna structure area on circuit boardsthereby improving integration performance.

In addition, most of existing antennas have a single-layer packagingstructure. These antennas have low efficiency, and cannot meet theincreasing requirements on antenna performance. Moreover, in an existingpackaging manner, an antenna feeder is packaged by using a PCBsubstrate. Holes are provided in a PCB substrate by means of mechanicaldrilling or laser drilling, and then metal is filled in the holes bymeans of chemical plating or electroplating, thereby packaging theantenna feeder. In this packaging manner, side walls of the antennafeeder are rough because the holes obtained through drilling have roughside walls. Rough side walls result in severe loss of signals sent andreceived by the antenna and hence degrade electrical properties of theantenna package. In addition, because the antenna feeder is fabricatedin the PCB substrate, it is impossible to fabricate a long antennafeeder, meanwhile the fabrication cost is high.

Based on the foregoing descriptions, it is necessary to provide anappropriate antenna package structure and a method to make it.

SUMMARY

The present disclosure provides an antenna feeder package structure. Theantenna feeder package structure comprises: a patterned antenna metallayer on a substrate; a metal joint pin fabricated aligned to thepatterned antenna metal layer by using a wire bonding process; and apackaging layer, covering the metal joint pin.

Optionally, the metal joint pin is made of gold, silver, copper, oraluminum.

Optionally, the packaging layer is made of polyimide, silica gel, orepoxy resin.

Optionally, a top surface of the packaging layer comprises a flatsurface.

Optionally, the antenna feeder package structure further comprises atleast two metal joint pin layers and another packaging layer, whereineach of the at least two metal joint pin layers comprises a plurality ofthe metal joint pins.

The present disclosure further provides a method for fabricating anantenna feeder package. The method for fabricating an antenna feederpackage comprises: providing a patterned conductive layer; forming ametal joint by using a wire bonding process; and covering the metaljoint pin with a packaging layer.

Optionally, the conductive layer comprises a redistribution layer or anantenna metal layer.

Optionally, the wire bonding process comprises one of athermos-compression bonding process, an ultrasonic wire bonding process,and a thermos-compression ultrasonic wire bonding process.

Optionally, a method for covering the metal joint pin with the packaginglayer comprises one of compression molding, transfer molding,hydro-forming, vacuum lamination and spin coating.

Optionally, a top surface of the packaging layer is planarized by meansof polishing or grinding.

Optionally, the antenna feeder package further comprises at least twometal joint pin layers and at least two of the packaging layers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 to FIG. 14 show the steps of fabricating an antenna package andsequential structural diagrams according to an embodiment in the presentdisclosure.

FIG. 15 to FIG. 27 show the steps of fabricating an antenna package andsequential structural diagrams according to another embodiment in thepresent disclosure.

FIG. 28 shows the structural diagram of an antenna package according tothe embodiment in FIGS. 15-27.

DESCRIPTIONS OF REFERENCE NUMERALS

-   101 Supporting substrate-   102 Separation layer-   103 First Antenna metal layer-   104 First Metal joint pin-   105 First Packaging layer-   106 Second Antenna metal layer-   107 Second Metal joint pin-   108 Second Packaging layer-   109 Redistribution layer-   110 Metal bump-   111 Antenna circuit chip-   112 Bottom filling layer

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Implementations of the present disclosure are illustrated below throughspecific embodiments. Those skilled in the art can easily understandother advantages and efficacy of the present disclosure according to thecontent disclosed in this specification. The present disclosure can alsobe implemented or applied through other different specificimplementations. Various modifications or variations can also be made ondetails in this specification based on different opinions andapplications without departing from the spirit of the presentdisclosure.

It should be noted that, the figures provided in this embodiment merelyillustrate the basic conception of the present disclosure schematically.Therefore, the figures only show components related to the presentdisclosure, and are not drawn according to the quantity, shapes andsizes of components during actual implementation. The pattern, quantityand ratio of components during actual implementation can be changedarbitrarily, and the component layout may also be more complex.

Embodiment 1

As shown in FIG. 28, the present embodiment provides a packagingstructure for an antenna. The packaging structure comprises aredistribution layer 109, a second metal joint pin 107, a secondpackaging layer 108, a second antenna metal layer 106, a first metaljoint pin 104, a first packaging layer 105, a first antenna metal layer103, a metal bump 110, an antenna circuit chip 111, and a bottom fillinglayer 112.

As shown in FIG. 28, the redistribution layer 109 has a first surfacefacing the chip and an opposite second surface.

As shown in FIG. 28, the redistribution layer 109 comprises a patternedfirst dielectric layer (not shown in the figures), a patterned firstmetal wiring layer (not shown in the figures), a patterned seconddielectric layer (not shown in the figures), and a patterned secondmetal wiring layer (not shown in the figures) which are sequentiallystacked, wherein the first metal wiring layer is electrically connectedwith the second metal wiring layer. Further, the first dielectric layerand the second dielectric layer are made from one or a combination oftwo or more of epoxy resin, silica gel, Polyimide (PI), Polybenzoxazole(PBO), Benzocyclobutene (BCB), silicon oxide, phosphorosilicate glassand fluorine-containing glass, and the first metal wiring layer and thesecond metal wiring layer are made from one or a combination of two ormore of copper, aluminum, nickel, gold, silver and titanium.

As shown in FIG. 28, the second metal joint pin 107 is formed on thesecond surface of the redistribution layer 109, and is electricallyconnected with the redistribution layer 109.

The second metal joint pin 107 is made from a metal material like Au,Ag, Cu, and Al.

As shown in FIG. 28, the second packaging layer 108 covers the secondmetal joint pin 107 and the redistribution layer 109. Meanwhile, thesecond metal joint pin 107's top surface is exposed.

The second packaging layer 108 is made from one of polyimide, silica geland epoxy resin. The top surface of the second packaging layer 108 is agrounded or polished flat surface, to improve the quality of the secondantenna metal layer 106.

As shown in FIG. 28, the second antenna metal layer 106 is formed on thesecond packaging layer 108, and the second antenna metal layer 106 iselectrically connected with the second metal joint pin 107.

The material of the second antenna metal layer 106 may be Au, or Cu,etc. The second antenna metal layer 106 may have various differentpatterns according to performance requirements.

As shown in FIG. 28, the second metal joint pin 107 is formed on thesecond antenna metal layer 106.

The second metal joint pin 107 is made from one of Au, Ag, Cu, and Al.

As shown in FIG. 28, the first packaging layer 105 covers the secondantenna metal layer 106, and exposes the second metal joint pin 107, andthe second metal joint pin 107 the top surface of the first packaginglayer 105.

The first packaging layer 105 is made from one of polyimide, silica geland epoxy resin. The top surface of the first packaging layer 105 is aground or polished flat surface, so as to improve the quality of thefirst antenna metal layer 103.

As shown in FIG. 28, the first antenna metal layer 103 is formed on thefirst packaging layer 105, and the first antenna metal layer 103protrudes from the surface of the first packaging layer 105. The secondantenna metal layer 106 may be made from Au, Cu, etc., and the secondantenna metal layer 106 may have various different patterns according toperformance requirements.

As shown in FIG. 28, the metal bump 110 is formed on the first surfaceof the redistribution layer 109. The metal bump 110 comprises a soldermaterial like f tin solder, silver solder and gold-tin alloy solder.

As shown in FIG. 28, the antenna circuit chip 111 is bonded to the firstsurface of the redistribution layer 109, and the antenna circuit chip111 is electrically connected with the second antenna metal layer 106and the first antenna metal layer 103 through the redistribution layer109, the second metal joint pin 107 and the first metal joint pin 104,so as to realize the functions of the antenna. Based on the structure,an antenna packaging structure with more layers can be realized by moremetal joint pins, packaging layers and antenna metal layers.

As shown in FIG. 28, the packaging structure further comprises a bottomfilling layer 112 filled between the antenna circuit chip 111 and theredistribution layer 109 to increase the bonding strength of the antennacircuit chip 111 to the redistribution layer 109 and protect theredistribution layer 109.

As shown in FIG. 15 to FIG. 28, the embodiment further provides apackaging method for an antenna, comprising the following steps:

Step 1), providing a supporting substrate 101, and forming a separationlayer 102 on the supporting substrate 101 as shown in FIG. 15.

As an example, the supporting substrate 101 may be one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate and a ceramic substrate. In the present embodiment, thesupporting substrate 101 is a glass substrate, the cost of the glasssubstrate is lower than other types, it is easy to form the separationlayer 102 on the surface of the glass substrate, and so it is easier forthe subsequent separation process.

As an example, the separation layer 102 may be an adhesive tape or apolymer layer. In the case of a polymer layer, the polymer is firstapplied to the surface of the supporting substrate 101 by a spin-coatingprocess, and then cured by a UV curing or thermal curing process.

In the present embodiment, the polymer layer comprises an LTHCphoto-thermal conversion layer, and the LTHC photo-thermal conversionlayer can be heated later in step 9) by laser light, so that asubsequently formed packaging layer 105 and the supporting substrate 101are separated from each other at the LTHC photo-thermal conversionlayer.

Step 2), forming a redistribution layer 109 on the separation layer 102,wherein the redistribution layer 109 comprises a first surface connectedwith the separation layer 102 and an opposite second surface, as shownin FIG. 16.

Forming the redistribution layer 109 of step 2) comprises the followingsteps:

step 2-1), forming a first dielectric layer as part of 109 on thesurface of the separation layer 102 by a chemical vapor depositionprocess or a physical vapor deposition process, and etching the firstdielectric layer to form a patterned first dielectric layer, wherein thefirst dielectric layer is made from one or a combination of two or moreof epoxy resin, silica gel, PI, PBO, BCB, silicon oxide,phosphorosilicate glass and fluorine-containing glass;

step 2-2) forming a first metal layer (not shown) on the surface of thepatterned first dielectric layer by a chemical vapor deposition process,an evaporation process, a sputtering process, an electroplating process,or an electroless plating process, and etching the first metal layer toform a patterned first metal wiring layer, wherein the first metalwiring layer is made from one or a combination of two or more of copper,aluminum, nickel, gold, silver and titanium;

step 2-3) forming a second dielectric layer on the surface of thepatterned first metal wiring layer by a chemical vapor depositionprocess or a physical vapor deposition process, and etching thedielectric layer to form a patterned second dielectric layer, whereinthe second dielectric layer is made from one or a combination of two ormore of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide,phosphorosilicate glass and fluorine-containing glass; and

step 2-4) forming a second metal layer on the surface of the patternedsecond dielectric layer by a chemical vapor deposition process, anevaporation process, a sputtering process, an electroplating process, oran electroless plating process, and etching the second metal layer toform a patterned second metal wiring layer, wherein the second metalwiring layer is electrically connected with the first metal wiringlayer. The second metal wiring layer is made from one or a combinationof two or more of copper, aluminum, nickel, gold, silver, and titanium.

Step 3), forming a second metal joint pin 107 on the second surface ofthe redistribution layer 109, as shown in FIG. 17.

In step 3), the second metal joint pin 107 is manufactured by a wirebonding process, wherein the wire bonding process comprises one of a hotpress wire bonding process, an ultrasonic wire bonding process and a hotpress ultrasonic wire bonding process, and the second metal joint pin107 is made from one of Au, Ag, Cu and Al.

Step 4), packaging the second metal joint pin 107 and the redistributionlayer 109 with a packaging layer 108, and then grinding the secondpackaging layer 108 until the second metal joint pin 107 is exposed fromthe top surface of the second packaging layer 108, as shown in FIG. 18to FIG. 19,.

Packaging the second metal joint pin 107 and the redistribution layer109 with the second packaging layer 108 in step 4) adopts one of thefollowing methods: compression molding, transfer molding, liquid sealmolding, vacuum lamination and spin coating, and the second packaginglayer 108 is made from one of polyimide, silica gel and epoxy resin.

Step 5), forming a second antenna metal layer 106 on the surface of thesecond packaging layer 108, wherein the second antenna metal layer 106is electrically connected with the second metal joint pin 107, as shownin FIG. 20.

For example, a metal layer may be formed on the surface of the secondpackaging layer 108 by evaporation or sputtering, and then the metallayer is patterned to form the second antenna metal layer 106 by anetching process. Optionally, the second antenna metal layer 106 may alsobe formed by a metal lift-off process, that is, forming a photoresistpattern on the surface of the second packaging layer 108 first, thenforming a metal layer on the photoresist pattern by an evaporation orsputtering method, and finally removing the photoresist pattern andseparating the metal layer from the photoresist pattern, with thepatterned antenna metal layer 106 left on the surface of the secondpackaging layer 108.

Step 6), forming a first metal joint pin 104 on the second antenna metallayer 106, as shown in FIG. 21.

In step 6), the first metal joint pin 104 is manufactured by a wirebonding process, wherein the wire bonding process is one of a hot presswire bonding process, an ultrasonic wire bonding process and a hot pressultrasonic wire bonding process, and the first metal joint pin 104 ismade from one of Au, Ag, Cu and Al.

Step 7), packaging the second antenna metal layer 106 and the firstmetal joint pin 104 with a packaging layer 105, and then grinding thefirst packaging layer 105 until the first metal joint pin 104 is exposedfrom the top surface of the first packaging layer 105, as shown in FIG.22 to FIG. 23.

Step 7) of packaging the second antenna metal layer 106 and the firstmetal joint pin 104 with a packaging layer 105 adopts one of thefollowing methods: compression molding, transfer molding, liquid sealmolding, vacuum lamination and spin coating, and the first packaginglayer 105 is made from one of polyimide, silica gel and epoxy resin.

Step 8), forming an antenna metal layer 103 on the surface of the firstpackaging layer 105, as shown in FIG. 24.

For example, a metal layer may be formed on the surface of the firstpackaging layer 105 by evaporation or sputtering method first, and themetal layer is patterned to form the first antenna metal layer 103 by anetching process. Of course, the first antenna metal layer 103 may alsobe formed by a metal lift-off process, that is, forming a photoresistpattern on the surface of the first packaging layer 105 first, thenforming a metal layer on the photoresist pattern by an evaporation orsputtering method, and finally removing the photoresist pattern andseparating the metal layer from the photoresist pattern, with thepatterned antenna metal layer 103 left on the surface of the firstpackaging layer 105.

Step 9), separating the redistribution layer 109 from the supportingsubstrate 101 based on the separation layer 102 to expose the firstsurface of the redistribution layer 109, as shown in FIG. 25.

For example, the LTHC photo-thermal conversion layer is heated by laserlight, so that the subsequently formed packaging layer 105 and thesupporting substrate 101 are separated from each other at the LTHCphoto-thermal conversion layer.

Step 10), forming a metal bump 110 on the first surface of theredistribution layer 109, as shown in FIG. 26.

The metal bump 110 comprises one of tin solder, silver solder andgold-tin alloy solder.

Step 11) and step 12) providing an antenna circuit chip 111, bonding theantenna circuit chip 111 to the first surface of the redistributionlayer 109, and finally forming a bottom filling layer 112 between theantenna circuit chip 111 and the redistribution layer 109 to increasethe bonding strength of the antenna circuit chip 111 and theredistribution layer 109 and protect the redistribution layer 109, asshown in FIG. 27 to FIG. 28.

Embodiment 2

As shown in FIG. 1 to FIG. 14, the present embodiment provides apackaging method for an antenna, comprising the following steps:

Step 1), providing a supporting substrate 101, and forming a separationlayer 102 on the supporting substrate 101, as shown in FIG. 1.

As an example, the supporting substrate 101 comprises one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate and a ceramic substrate. In the present embodiment, thesupporting substrate 101 is a glass substrate, the cost of the glasssubstrate is low, it is easy to form the separation layer 102 on thesurface of the glass substrate, and the difficulty of the subsequentseparation process can be reduced.

As an example, the separation layer 102 comprises one of an adhesivetape and a polymer layer. The polymer layer is first applied to thesurface of the supporting substrate 101 by a spin-coating process, andthen cured by a UV curing or thermal curing process.

The polymer layer comprises an LTHC photo-thermal conversion layer, andthe LTHC photo-thermal conversion layer can be heated later in step 11)by laser light, so that the first packaging layer 105 and the supportingsubstrate 101 are separated from each other at the LTHC photo-thermalconversion layer.

Step 2), forming an antenna metal layer 103 on the separation layer 102,as shown in FIG. 2.

For example, a metal layer may be formed on the surface of theseparation layer 102 by an evaporation or sputtering method first, andthen the metal layer is patterned form the first antenna metal layer 103by an etching process. Optionally, the first antenna metal layer 103 mayalso be formed by a metal lift-off process, that is, forming aphotoresist pattern on the surface of the separation layer 102 first,then forming a metal layer on the photoresist pattern by an evaporationor sputtering method, and finally removing the photoresist pattern andseparating the metal layer from the photoresist pattern, with thepatterned antenna metal layer 103 left on the surface of the separationlayer 102.

Step 3), forming a first metal joint pin 104 on the first antenna metallayer 103, as shown in FIG. 3.

The first metal joint pin 104 is manufactured by a wire bonding process,wherein the wire bonding process is one of a hot press wire bondingprocess, an ultrasonic wire bonding process and a hot press ultrasonicwire bonding process, and the first metal joint pin 104 is made from oneof Au, Ag, Cu, and Al.

Step 4), packaging the first antenna metal layer 103 and the first metaljoint pin 104 with a packaging layer 105, so that the first metal jointpin 104 is exposed from the top surface of the first packaging layer105, as shown in FIG. 4 to FIG. 5.

The packaging of the first antenna metal layer 103 and the first metaljoint pin 104 with a packaging layer 105 adopts one of the followingmethods: compression molding, transfer molding, liquid seal molding,vacuum lamination and spin coating, and the first packaging layer 105 ismade from one of polyimide, silica gel and epoxy resin.

Step 5), forming an antenna metal layer 106 on the surface of the firstpackaging layer 105, wherein the second antenna metal layer 106 iselectrically connected with the first metal joint pin 104, as shown inFIG. 6.

Step 6), forming a second metal joint pin 107 on the second antennametal layer 106, as shown in FIG. 7.

The second metal joint pin 107 is manufactured by a wire bondingprocess, wherein the wire bonding process is one of a hot press wirebonding process, an ultrasonic wire bonding process and a hot pressultrasonic wire bonding process, and the first metal joint pin 107 andsecond metal joint pin 107 are made from one of Au, Ag, Cu and Al.

Step 7), packaging the second antenna metal layer 106 and second metaljoint pin 107 with a packaging layer 108, so that second metal joint pin107 is exposed from the top surface of the second packaging layer 108,as shown in FIG. 8 to FIG. 9.

The packaging of the second antenna metal layer 106 and second metaljoint pin 107 with a packaging layer 108 adopts one of the followingmethods: compression molding, transfer molding, liquid seal molding,vacuum lamination and spin coating, and the second packaging layer 108is made from one of polyimide, silica gel and epoxy resin.

Step 8), forming a redistribution layer 109 on the surface of the secondpackaging layer 108, wherein the redistribution layer 109 iselectrically connected with second metal joint pin 107, As shown in FIG.10.

Step 8) of forming the redistribution layer 109 comprises the followingsteps:

8-1), forming a first dielectric layer on the surface of the secondpackaging layer 108 by a chemical vapor deposition process or a physicalvapor deposition process, and etching the first dielectric layer to forma patterned first dielectric layer;

8-2) forming a first metal layer on the surface of the patterned firstdielectric layer by a chemical vapor deposition process, an evaporationprocess, a sputtering process, an electroplating process, or anelectroless plating process, and etching the first metal layer to form apatterned first metal wiring layer, wherein the first metal wiring layeris electrically connected with second metal joint pin 107;

8-3) forming a second dielectric layer on the surface of the patternedfirst metal wiring layer by a chemical vapor deposition process or aphysical vapor deposition process, and etching the dielectric layer toform a patterned second dielectric layer; and

8-4) forming a second metal layer on the surface of the patterned seconddielectric layer by a chemical vapor deposition process, an evaporationprocess, a sputtering process, an electroplating process, or anelectroless plating process, and etching the second metal layer to forma patterned second metal wiring layer, wherein the second metal wiringlayer is electrically connected with the first metal wiring layer.

The first dielectric layer and the second dielectric layer are made fromone or a combination of two or more of epoxy resin, silica gel, PI, PBO,BCB, silicon oxide, phosphorosilicate glass and fluorine-containingglass, and the first metal wiring layer and the second metal wiringlayer are made from one or a combination of two or more of copper,aluminum, nickel, gold, silver and titanium.

Step 9), forming a metal bump 110 on the redistribution layer 109, asshown in FIG. 11.

The metal bump 110 comprises one of tin solder, silver solder andgold-tin alloy solder.

Step 10), providing an antenna circuit chip 111, and bonding the antennacircuit chip 111 to the redistribution layer 109, as shown in FIG. 12.

Between step 10) and step 11), the packaging method further comprises:forming a bottom filling layer 112 between the antenna circuit chip 111and the redistribution layer 109 to increase the bonding strength of theantenna circuit chip 111 and the redistribution layer 109 and protectthe redistribution layer 109.

Step 11), separating the first packaging layer 105 from the supportingsubstrate 101 based on the separation layer 102, as shown in FIG. 13 toFIG. 14.

As shown in FIG. 14, the present embodiment further provides a packagingstructure for an antenna. The basic structure is the same as that ofembodiment 1, and the main difference from embodiment 1 lies in that thefirst antenna metal layer 103 of the packaging structure sinks into thefirst packaging layer 105, such that the side face of the first antennametal layer 103 is covered by the first packaging layer 105, which cangreatly improve the mechanical stability of the first antenna metallayer 103 and improve the overall performance of the packagingstructure.

The disclosed device have the following benefits:

the packaging structure for an antenna according to the presentdisclosure adopts the redistribution layer to realize the integration oftwo or more antenna metal layers, greatly improving the efficiency andperformance of the antenna, and the packaging structure and packagingmethod for an antenna according to the present disclosure have a highintegration level; and

in the present disclosure, a fan-out packaging method is adopted topackage the antenna, which can effectively reduce the packaging volume,and make the packaging structure for an antenna have a high integrationlevel and better packaging performance, thereby having a wideapplication prospect in the field of semiconductor packaging.

Therefore, the present disclosure effectively overcomes variousdisadvantages in the prior art and has high industrial utilizationvalue.

The above-described embodiments merely illustrate the principles andeffects of the present disclosure, but are not intended to limit thepresent disclosure. Any person skilled in the art can modify or changethe above embodiments without departing from the spirit and scope of thepresent disclosure. Therefore, all equivalent modifications or changesmade by persons of ordinary skill in the art without departing from thespirit and technical thought disclosed in the present disclosure shallstill be covered by the claims of the present disclosure.

What is claimed is:
 1. An antenna feeder package structure, comprising:a substrate; a first patterned antenna metal layer disposed on thesubstrate; a first metal joint pin fabricated aligned to the firstpatterned antenna metal layer by using a wire bonding process; apackaging layer, covering the first metal joint pin except a topsurface, wherein the top surface of the first metal joint pin is indirect contact with a second patterned antenna metal layer; a secondmetal joint pin aligned to the second patterned antenna metal layer byusing the wire bonding process; a second packaging layer disposed tocover the second metal joint pin except a top surface; a first portionof a conductive redistribution layer in direct contact with the topsurface of the second metal joint pin; a second portion of theconductive redistribution layer arranged to be in direct contact with ametal solder ball; and a third portion of the conductive redistributionlayer arranged to be in direct contact with pads of an antenna circuitchip, wherein a bottom filling layer is disposed outside the pads andbetween the third portion of the conductive redistribution layer and theantenna circuit chip.
 2. The antenna feeder package structure accordingto claim 1, wherein the metal joint pin is made of gold, silver, copper,or aluminum.
 3. The antenna feeder package structure according to claim1, wherein the packaging layer is made of polyimide, silica gel or epoxyresin.
 4. The antenna feeder package structure according to claim 1,wherein a top surface of the packaging layer comprises a flat surface.5. The antenna feeder package structure according to claim 1, whereinthe antenna feeder package structure further comprises at least twometal joint pin layers and another packaging layer, wherein each of theat least two metal joint pin layers comprises a plurality of the metaljoint pins.